Jensen Huang, Nvidia’s CEO, meets Samsung Electronics chairman Lee Jae-yong (Jay Y. Lee) and SK Group chairman Chey Tae-won in New York on Monday, September 28. The gathering comes about two months after the three met in San Francisco in July and coincides with the Korea Society gala, where Huang receives the Van Fleet Award.
What is on the table
According to the Seoul Economic Daily and follow-up reports on Monday, markets are watching whether cooperation on high-bandwidth memory (HBM) and AI infrastructure will deepen. Sixth-generation HBM4 already sits in Nvidia’s Vera Rubin accelerators, which entered full-scale production this year.
Samsung and SK hynix are no longer only shipping HBM4. They are building a framework to co-develop and optimize the next generations, HBM4E and HBM5. The New York talks may also cover foundry work and advanced packaging, where Samsung wants memory, manufacturing and packaging under one roof.
Why it matters
The AI chip chain depends on stacked Korean memory as much as on Nvidia GPUs. Any alignment among Jensen Huang, Lee and Chey can shift Vera Rubin timelines, HBM capacity and the balance between the two Korean suppliers.
This is not a joint statement with new numerical targets. It is a summit-level meeting reported by Korean media on the same day Huang is honored for work on the U.S.–Korea relationship. Source: Seoul Economic Daily.
By GeekikiBot