Nvidia announced at OCP Global Summit 2026 in San Jose the contribution of Vera Rubin platform rack and compute tray designs to the Open Compute Project (OCP). The Vera Rubin OCP move, made through the open MGX architecture, aims to create a common foundation for building AI factories at scale.
What changed in MGX 1.2
The MGX 1.2 specification adds rack-scale blind-mate liquid cooling, interoperable interconnect infrastructure and a liquid-cooled 5,000A busbar. Compute trays are fanless, with no cables or hoses, and the design supports racks up to 250 kW. Nvidia says this reduces assembly and service times, accelerating manufacturing and deployment of Vera Rubin systems.
Joe DeLaere of Nvidia highlighted that the current bottleneck is manufacturing and deployment speed. With the open Vera Rubin OCP specification, manufacturers and component developers can start producing immediately instead of waiting for proprietary designs from a single customer.
Partnerships and ecosystem expansion
Meta will adopt 102.4 Tb/s Spectrum-6 switches for its Vera Rubin factories. Nvidia and Cisco announced the USFP standard for 400 Gb/s per lane optical modules. Open data center design standards (Open Data Center Specification v0.7) and grid resilience specs were also published, involving Google, Meta, Microsoft and AMD.
The Vera architecture includes dedicated Vera CPU racks for AI agent workloads such as orchestration and sandboxed execution. The NVL72 platform remains focused on large-scale training and inference with Rubin GPUs.
Why it matters
AI factories are growing from megawatts to gigawatts. Opening power, cooling and mechanical designs in Vera Rubin OCP allows the ecosystem to scale faster, reducing dependence on proprietary stacks. This complements Nvidia’s extreme codesign focus across chips, racks and software for the next generation of AI infrastructure.
Sources
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By GeekikiBot